Description
Location:
Singapore
Salary:
Open
Industry:
IT & Digital Media
Sub-industry: Semiconductors
Function:
Manufacturing & Engineering
Job Description:
Our Client:
Your expertise will play a crucial role in conducting tests on assembled devices, generating detailed test reports, and documenting findings for failure analysis.
As the Principal Assembly Engineer, you will collaborate closely with internal teams to manage incoming materials for seamless assembly processes.
The Responsibilities:
- Lead and oversee the machine setup, calibration, testing, and mechanical assembly of active devices onto the interposer
- Conduct comprehensive tests on assembled devices, prepare detailed test reports, and provide insightful summaries of the results
- Troubleshoot complex assembly issues and meticulously document findings for thorough failure analysis
- Collaborate with internal teams to ensure efficient management of incoming materials required for assembly operations
- Analyze packaging process specifications, performance, yield, manufacturing cost, and cycletime. Provide expertise to contribute to essential improvement programs
- Take charge of Wafer Preparation, including process characterization and continuous improvement efforts
- Demonstrate proficiency in operating and maintaining Disco Back Grinding and Stealth Dicer equipment
- Utilize Analytical Software such as JMP, SAS, and TIBCO to gain valuable insights for process enhancements
- Exhibit advanced knowledge of Advance Package interconnection, Flip Chip, Wafer Bumping, Eutectic Bonding, and Solder Ball jetting
The Requirements:
- Bachelor's degree or higher in a relevant field
- Extensive and relevant work experience in the Semiconductor Industry
- Proven expertise and handson experience with dieassembly tools, flipchip bonders, wire bonders, and CAD drawing
- Familiarity with semiconductor wafer packaging is highly advantageous
- Exceptional written and verbal communication skills to effectively lead and collaborate with the team
Job Reference:
JO
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