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    engineer, pde package silicon integration - Singapur, Singapore - Micron

    Micron
    Micron Singapur, Singapore

    2 weeks ago

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    Description

    Our vision is to transform how the world uses information to enrich life for all.

    Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

    JR46810 ENGINEER, PDE PACKAGE SILICON INTEGRATION

    As a Package-Silicon Integration Engineer in Micron's Package Development Engineering (PDE) Group, you will be responsible for driving advanced IC package development for next generation silicon and package technologies.

    You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

    RESPONSIBILITIES

  • Work with package design and development teams to complete chip package interaction risk assessment.
  • Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules and design FMEA.
  • Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
  • Contribute to development of new silicon and package technologies by engaging with Micron's internal factories.
  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
  • Identify technology, quality and business process gaps and develop and deploy needed solutions.
  • Be the contact window to the Si design, scribe design and wafer fab regarding the progress of key projects.

    • EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

  • PhD, Masters or Bachelor's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical)
  • Demonstrate project management experience through academic projects.
  • Possess sound methodology for organizing work, decision-making and setting priorities
  • Knowledge of semiconductor fabrication or CMOS device is preferred.
  • Knowledge in PFMEA, DFMEA, DOE, Fish-Bone Analysis is preferred.
  • Strong analytical, problem solving, and organizational skills
  • Proficiency in computer applications like Excel, Word, Power Point.
  • Self-motivated and team-oriented.
  • Strong interpersonal, oral and written English communications-skills.
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