Jing Ning Yap

Experienced engineer skilled in quality control, process improvement, and problem troubleshooting in the semiconductor and rubber manufacturing fields. A quick learner who excels in high-pressure, multi-tasking environments with strong interpersonal communication skills. Possesses a self-motivated work ethic and ability to work independently and in teams.

Micron Semiconductor Asia Pte Ltd 

Nov 2022 – Feb 2023. 

Processes And Equipment Engineer 

• Deployed Chemical Mechanical Planarization (CMP) Module equipment and Semiconductor manufacturing process. 

• Classified wafer defects from wafer map pattern. 

• Performed root cause analysis and identified appropriate solutions for production. 

• Monitored process performances with statistical process control (SPC). 

• Optimized break-in and polishing recipe for reducing wafer defects by 20%. 

• Improved process by introducing cost saving material and new technology. 

• Planned and monitored on project plan, project monitoring and project reporting.

University Technology Petronas 

Sept 2018 – Aug 2022. 

• Bachelor of Chemical Engineering. 

• First Class Honours with 3.80/4.00 CGPA