- Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
- Work with equipment suppliers to develop new capability
- Actively participate in Package Development Engineering activities
- Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
- Create decision matrix for equipment and material selection
- Plan/submit capital request to acquire new Equipment
- Create purchasing specification (Doc2) document
- Establish the new equipment qualification criteria and activities roadmap with respective functional team
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owner
- Conduct data gathering for low volume production
- Conduct training for Site representatives/personnel
- Establish the feedback loop for Continuous Improvement after mass volume production
- Maintain and regularly update the TOR, with inputs from local or other assembly site
- Maintain general knowledge of process and material characteristics and translate to equipment design requirement
- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need
- Maintain knowledge of design constraints and weakness of existing platform
- Participate in the continuous improvement projects involving equipment improvement and upgrades
- PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
- Minimum 2 years' experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good team player, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers' requirement
- Strong project management skills to ensure execution to timelines
Senior Engr, Advanced Package FEOL - Singapur, Singapore - Micron
Description
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR51022 Senior Engr, Advanced Package FEOLIdentify, select, and evaluate new process, equipment and/or technology to support current and future requirements for FEOL area
Installation and qualification of new equipment platform and handover to production group (pilot line setup)
Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform
Collaborate with production group on upgrades of existing production equipment through continuous improvement projects
Job Requirements/ Qualifications: