Mechanical Design Engineer TCB - North Region
Only for registered members North Region, Singapore
4 weeks ago
* This salary range is an estimation made by beBee
Job summary
We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment.
Responsibilities
- Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
- Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
- Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
- Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
Qualifications
- Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
- 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
- Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
Job description
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