Engineer (Failure Analysis) - Singapore - STATS CHIPPAC PTE. LTD.

STATS CHIPPAC PTE. LTD.
STATS CHIPPAC PTE. LTD.
Verified Company
Singapore

2 weeks ago

Wei Jie

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Wei Jie

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Description

Key Job Accountabilities:


  • Perform failure analysis on integrated circuit (IC) package chips to identify root causes of failures
  • Perform reliability tests for customer qualifications, new package development qualifications, process / material qualifications and inhouse evaluations
  • Participate in internal and customer meetings, issue resolution, and audits technically and effectively
  • Maintain all FA & Rel equipment in laboratory and ensure functionality at all times
  • Supervise a team of Associate Engineers or Technicians
  • Update FA methods
  • Train new staff in usage and familiarization of equipment in FA & Rel Lab

Requirements:


  • Minimum Degree in Electronic and/or Electrical Engineering or any related field
  • At least 2 years' related experience in IC packaging environment
  • Good working knowledge and experience in IC failure analysis techniques
  • Preferably familiar with industrial reliability test standards such as Mil-Std 883 and JEDEC standards
  • Some knowledge of Wafer process or Wafer BE process is an advantage
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