Principal Assembly Engineer - Singapore - RGF

RGF

Verified Company

Singapore

1 week ago

Posted by:

Wei Jie

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Description

Location:
Singapore

Salary:
Open

Industry:
IT & Digital Media

Sub-industry: Semiconductors

Function:
Corporate Planning

Job Description:

Our Client:

Our client's focus is on chip-scale integrated photonics solutions using their optical interposer technology. They are actively looking for a Principal Assembly Engineer to join their team in Singapore.

The Responsibilities:

Design and develop next generation optical interposers leveraging silicon/TSV and advanced 2/5/3D IC packaging solutions
Define package stackup, routing and PDN requirements for new products
Work with external vendors to develop wafer processes and integration for 2.5D/3D heterogeneous integration
Manage wafer lot handling and define metrology inspection process control requirements
Analyze process data and provide technical feedback to drive product development
Manage critical technical deliverables, timeline and provide regular updates to management and stakeholders
Perform analysis on packaging process specs performance, yield, manufacturing cost, and cycletime; and contribute to planning and execution of essential improvement programs
Provides documentation & regular technical reporting, and technical support and coordination with the Company NPI teams to fulfil the Company Technology and Product Development programs

The Requirements:

Serve as a technical team or task leader, ready to quickly learn new techniques with a passionate R&D mindset
Interfaces with supplier and internal staff concerning quality and assure that effective corrective action or improvement is implemented
Ontime completion of packagingoptics design and process development
Monitoring and Improvement of packaging process capabilities
Product and Process capability maintenance/ improvement leading to yield enhancement, including data analysis
Development of ROE/TOE/TROE processes and product prototypes to support the programs championed by the new product development agenda in the company
Delivery of HIPP assembly process capability items and assembled prototypes and production samples as per NPD program requirements
Electronic packaging knowledge, with knowledge of TSV processing a must. Photonic packaging knowledge is a plus
Handon experience with dieassembly tool, flipchip bonder, wire bonder, and CAD drawing is strongly recommended
Understanding the packaging of semiconductor wafers is a plus
Knowledge of uptodate production and automation equipment, processes, designs, and functions