Senior Product Engineer - Singapore - MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Description

Comprehension of NAND reliability requirement: The role requires understanding of NAND reliability requirement. This is critical for ensuring that the NAND products meet all the necessary reliability requirements.

Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, NAND Technology Development, NAND Design, NAND Product Development, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Addressing Reliability Failures: The role involves evaluating and addressing reliability failures encountered during qualification with relevant teams. This is crucial for ensuring that any issues are quickly identified and resolved, thereby maintaining the high quality and reliability of the products.

Data Analysis for problem-solving: Utilizing in-house statistical tools for engineering data analysis and risk assessment provides valuable insights into the performance and reliability of the products.

Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields, reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.

Reliability and Defectivity Improvement: This role drives the defectivity reduction during NPI for NAND qualification by documenting Reliability/defectivity failure Mode & Effect Analysis, Developing and validating Stress/Screen, New feature validation and deployment, Performing electrical failure analysis , understanding root cause and providing solution space. Team member works in cross functional environment.

Task Force Leadership: Leading task forces on reliability/defectivity projects related to the Fab process requires ownership within Product Engineering and coordination with multiple teams. This role is essential for addressing and resolving critical issues coming from component and system platform that may arise during the qualification process.

• Excellent written and verbal communication skills
• Solid technical judgment with good analytical and problem-solving skills.
• Able to work in high-pace environment, adaptable and deliver results within deadline.
• Strong teamwork skills and able to collaborative with cross functional team.
• Good understanding of 3D NAND defect mechanisms, NAND test flows and manufacturing process.
• Candidates with strong grasp of Machine/Deep Learning, Perl, Linux, Power BI, Tableau skills is advantages
• Opportunity to work on leading-edge and latest Non-volatile Memory.
• Exposure to overall Product Life Cycle activities from NPI to HVM.
• Lot of learning opportunity and chance to work with various functional teams from Operations, Fab, Test Solution team, Quality, System teams, Global Supply Chain.
• Work on innovative initiatives such as Machine Learning, Advanced analytics to improve BIC Yield, Cost, Quality.