sriman mishra

Semiconductor industry professional with 23 years of global experience with semiconductor foundries, OSAT and IDMs.

An individual with proven track record in managing engineers, project management, process optimisation, new process, equipment qualification and development.

Extensive experience in semiconductor front end wafer fab technologies like, Wet Etch, Plasma etch, and plating.

Extensive experience in dry etch, wet etch, plating processes in semiconductor assembly and wafer level packaging industry.

Six sigma black belt certified process manager.

ACTA certified technical trainer.

Award winner in implementing innovative improvement projects in different companies.

Skilled in training and applying FMEA, 8D, DOE and DMAIC for systematic problem solving.

Semiconductor industry professional with 23 years of global experience with semiconductor foundries, OSAT and IDMs.
Extensive experience in semiconductor front end wafer fab technologies like, Wet Etch, Plasma etch, and plating.
Extensive experience in dry etch, wet etch, plating processes in semiconductor assembly and wafer level packaging industry.
Six sigma black belt certified process manager.
ACTA certified technical trainer.
Award winner in implementing innovative improvement projects in different companies.
Skilled in training and applying FMEA, 8D, DOE and DMAIC for systematic problem solving.

  Masters in Electronics from Berhampur University, India in 1997.                               Masters in Business Administration from Berhampur University, India in 1999 with specialisation in Sales & Marketing.