Terry Beh

Executive summary

• 18 years working experience in semiconductor industry specialized in wafer factory processes in SACVD, PECVD, HDP-CVD; back end Thin Film Flip Chip process.
• 10 years in the front-end wafer fabrication thin film process, 7 years in back-end flip chip process, 1 year in apparel industry as solution consultant.
• 4 years leadership management of a group of equipment engineers, associate engineers, and technicians
• Experienced in new plan set up, site expansion, project transferred in a medical device industry, semiconductor, and crossover apparel industry, focus on machine installation, capacity improvement, sustainability equipment performance upkeep OEE target.
• Project management experience involvement during site expansion, project transferred and new plant set up.
• Initiated continuous improvement activities through used DAMIC six sigma approach: Kaizen, Value Stream Mapping, Continuous improvement projects, 6S.
• Problem-solving skill with used 6σ tools for any improvement project to assist production run in industry 4.0.
• Operates & lead well in both individual and team capacities, leveraging seasoned work ethic to quickly adapt to different processes and drive company objectives. Resourceful and results-driven with a passion for growth and efficiency to meet company needs and increase service value. 
• Highly organized and detail-oriented worker, with a drive to exceed expectations. Ability to analyze data, develop strategies, and provide solutions to complex problems. Seeking to leverage skills and knowledge to contribute to team success

• Bachelor Degree of Electrical Engineering (National Taiwan Ocean University, Taiwan)
• Certified in CSSBB (Certified Six Sigma Black Belt) in 2020
• Certified in LSSGB (Lean Six Sigma Green Belt) in 2011