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- Communicate and work closely with cross-functional teams include Product Test Engineering , RMA engineering for failure verification/validation, test set up and/or test characterization.
- Perform EFI by using techniques of emission & laser stimulation, which include the Thermal emission, Photon emission, Obirch/TIVA, Dynamic Laser Stimulation and so on.
- Perform PFA include both package and silicon die level analysis by using CSAM, X-ray, sample preparation, SEM/EDX, FIB etc.
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- Compile FA images, data into final FA report and communicate with requestors/customers.
- Participate in new FA techniques/methodologies/recipes development and tool's evaluation projects.
- Degree in IC Design. /Electrical Computer/Material Science/Mechanical or equivalent.
- Min. 3 years of FA experience in semiconductor industry.
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- Fast for learning and able to perform independent work.
- Good communication skill and team work spirit.
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Senior Failure Analysis Engineer - Singapore - Qualcomm
Description
Company:
Qualcomm Global Trading Pte. Ltd.
Job Area:
Engineering Group, Engineering Group > Failure Analysis Engineering
General Summary:
Job Responsibilities:
Job Requirements:
Minimum Qualifications:
• Bachelor's degree or equivalent in Science, Engineering, or related field and 2+ years of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience. .
OR
Master's degree in Science, Engineering, or related field and 1+ year of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience.
OR
PhD in Science, Engineering, or related field.
• 1+ year of working experience in a physical/chemical laboratory setting.
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification