Pei Yen Chan

Currently a senior application engineer at Henkel Singapore Pte Ltd. Delivering value to consumer electronics and sensors customers through understanding customers' pain points and providing technical solutions to customers with Henkel's products and eventually drive market share gain in adhesive technologies business unit.

Previously a senior failure analysis engineer at HPI Singapore with 7+ years of experience in general failure analysis of printhead products and thermal analysis of adhesives, polymers, polymer matrix composites (TGA, DSC/mDSC, DMA and Rheometer).

Previous responsibilities include product failure analysis, materials compatibility, engineering materials/process change qualification, lab capability development and NPI support in collaboration with cross-functional teams in the organization. My work experience has given me the necessary skills to recommend the best approach to drive root cause resolution on product failures, manufacturing line issues, customer returns etc.

Drive root cause resolution of product failures and manufacturing line issues using analytical tools such as optical microscope, FESEM/EDX, FIBSEM, thermal analysis tools (TGA, DSC/mDSC, DMA and Rheometer), DAGE bond tester, FTIR, SWLI, CSAM, CT (X-rays), GCMS, LCMS, ICP-OES, cross-section, metrology etc.

National University of Singapore

2017 – 2019

Graduate Diploma in Materials Science and Engineering

Nanyang Technological University

2010 - 2014

Bachelor of Engineering (B.Eng.), Materials Science and Engineering

2nd Upper Honours